JPH0628250Y2 - 電子部品の樹脂封止成形用金型 - Google Patents
電子部品の樹脂封止成形用金型Info
- Publication number
- JPH0628250Y2 JPH0628250Y2 JP1988144802U JP14480288U JPH0628250Y2 JP H0628250 Y2 JPH0628250 Y2 JP H0628250Y2 JP 1988144802 U JP1988144802 U JP 1988144802U JP 14480288 U JP14480288 U JP 14480288U JP H0628250 Y2 JPH0628250 Y2 JP H0628250Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- molten resin
- cull
- communicating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 76
- 229920005989 resin Polymers 0.000 title claims description 76
- 238000000465 moulding Methods 0.000 title claims description 15
- 238000005538 encapsulation Methods 0.000 title description 8
- 239000000463 material Substances 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 description 14
- 239000011800 void material Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988144802U JPH0628250Y2 (ja) | 1988-11-05 | 1988-11-05 | 電子部品の樹脂封止成形用金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988144802U JPH0628250Y2 (ja) | 1988-11-05 | 1988-11-05 | 電子部品の樹脂封止成形用金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0265524U JPH0265524U (en]) | 1990-05-17 |
JPH0628250Y2 true JPH0628250Y2 (ja) | 1994-08-03 |
Family
ID=31412829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988144802U Expired - Lifetime JPH0628250Y2 (ja) | 1988-11-05 | 1988-11-05 | 電子部品の樹脂封止成形用金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0628250Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4241108A (en) * | 1978-10-10 | 1980-12-23 | Rca Corporation | Sprayable titanium composition |
-
1988
- 1988-11-05 JP JP1988144802U patent/JPH0628250Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0265524U (en]) | 1990-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2564707B2 (ja) | 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置 | |
US5204122A (en) | Mold for use in resin encapsulation molding | |
US5723156A (en) | Mold for molding a semiconductor package | |
WO2007083490A1 (ja) | 電子部品の樹脂封止成形方法、ならびに、それに用いられる型組品およびリードフレーム | |
JP3727446B2 (ja) | 半導体装置の樹脂封止成形金型 | |
JPH0628250Y2 (ja) | 電子部品の樹脂封止成形用金型 | |
JPH11126787A (ja) | 電子部品の樹脂封止成形方法及び金型 | |
JP2598988B2 (ja) | 電子部品の樹脂封止成形方法 | |
JP3795684B2 (ja) | 電子部品の樹脂封止成形方法 | |
JP2834257B2 (ja) | 半導体装置の製造方法およびモールド装置 | |
JPS609131A (ja) | 半導体装置の樹脂封止方法及び樹脂封止装置 | |
JPH05175396A (ja) | リードフレーム及びモールド方法 | |
JP2609894B2 (ja) | 被封止部品のトランスファ樹脂封止成形方法とこれに用いられる樹脂封止成形用金型装置及びフィルムキャリア | |
JPS5994428A (ja) | 半導体用樹脂封止金型 | |
JPS6063122A (ja) | 半導体素子の樹脂封入成形方法及びその金型装置 | |
JP3795670B2 (ja) | 電子部品の樹脂封止成形方法 | |
JPH0510361Y2 (en]) | ||
JP2730873B2 (ja) | 半導体装置の製造方法 | |
JP3581743B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH0521877Y2 (en]) | ||
JP2575718B2 (ja) | 半導体素子の樹脂封止成形方法とその成形用金型装置及びその方法に用いられるリ−ドフレ−ム | |
JP2665668B2 (ja) | 電子部品の樹脂封止成形方法及びその樹脂封止成形用金型 | |
JPH058253A (ja) | 電子部品の樹脂封止成形装置 | |
JP2992982B2 (ja) | 電子部品の樹脂封止部成形用金型装置 | |
JP3609821B1 (ja) | 半導体装置封止用金型およびそれを用いた半導体装置封止方法 |